Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new packaging method, and the world's leading pure-play foundry has reportedly ...

Manz Asia will be demonstrating its advanced inkjet metallization using Smartkem's (SMTK) advanced dielectric materials at SEMICON® SEA 2025 in Singapore, May 20-22, 2025. Visit Manz Asia at Booth no.

New York Gov. Kathy Hochul announced on Friday that semiconductor manufacturer GlobalFoundries will be creating a new center for advanced packaging and testing in Saratoga County. GlobalFoundries is ...

Project is being supported by $75 million federal grant and $20 million from New York state; GF will also spend $186 million on research GlobalFoundries' Fab 8 campus is seen in February 2024 in Malta ...

TL;DR: TSMC is developing an advanced chip packaging plant in the US, influenced by President Trump's proposed tariffs on Taiwanese semiconductors. Trump aims to return chip production to the US, ...

The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...