PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology with multi-layer redistribution layers (RDL).

The substrate-like PCB market is growing with the increasing acceptance of these components among OEMs, smart consumer electronics, and wearable devices. The market for these PCBs is also growing due ...

Dublin, June 23, 2023 (GLOBE NEWSWIRE) -- The "IC Substrate in the Global PCB Market: Trends, Opportunities and Competitive Analysis 2023-2028" report has been added to ResearchAndMarkets.com's ...

Our appetite for new gadgets is resulting in a huge e-waste problem, with just a fraction of the 50 million tonnes of tech thrown away each year being recycled. Looking to tackle a significant part of ...

Taiwan-based IC substrate makers Unimcron, Na Ya PCB and Kinsus Interconnect Technology are actively proceeding with capacity expansions for ABF substrates in 2020 to meet robust demand for processing ...

As silicon technology advances to enable higher density ASICs, the core logic voltage decreases. The lower voltage, in combination with higher current requirements, requires tighter tolerances on the ...

Nanya PCB (NPC) is actively improving its production yield rates for CPU-use flip-chip (FC) substrate packaging in order to gain a larger share of orders from Intel, according to industry sources. The ...

According to new research study on “Substrate-Like-PCB Market,” the report delivers comprehensive insights into the market’s size, share, trends, and analysis. It encompasses a wealth of information ...

Laird Technologies’ T-preg HTD is a thermally conductive, electrically insulating pre-preg with high temperature and voltage properties for use in pc boards. Laird Technologies’ T-preg HTD is a ...